| Processor Number | i3-350M |
| # of Cores | 2 |
| # of Threads | 4 |
| Clock Speed | 2.26 GHz |
| Intel® Smart Cache | 3 MB |
| DMI | 2.5 GT/s |
| Instruction Set | 64-bit |
| Instruction Set Extensions | SSE4.1, SSE4.2 |
| Embedded Options Available | No |
| Lithography | 32 nm |
| Max TDP | 35 W |
| Processor Graphics ‡ | Intel® HD Graphics |
| Graphics Base Frequency | 500 MHz |
| Graphics Max Dynamic Frequency | 667 MHz |
| Intel® Flexible Display Interface (Intel® FDI) | Yes |
| Intel® Clear Video HD Technology | Yes |
| Intel® Clear Video Technology | Yes |
| TJUNCTION | 90°C for rPGA, 105°C for BGA |
| Package Size | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
| Processing Die Size | 81 mm2 |
| # of Processing Die Transistors | 382 million |
| Graphics and IMC Lithography | 45 nm |
| Graphics and IMC Die Size | 114 mm2 |
| # of Graphics and IMC Die Transistors | 177 million |
| Sockets Supported | BGA1288 |
| Intel® Hyper-Threading Technology | Yes |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® VT-x with Extended Page Tables (EPT) | Yes |
| Intel® 64 | Yes |
| Idle States | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Fast Memory Access | Yes |
| Intel® Flex Memory Access | Yes |
