| Launch Date | Q4'07 |
| Expected Discontinuance | Q4'2010 |
| Processor Number | X5272 |
| # of Cores | 2 |
| Clock Speed | 3.4 GHz |
| L2 Cache | 6 MB |
| FSB Speed | 1600 MHz |
| FSB Parity | No |
| Instruction Set | 64-bit |
| Embedded Options Available | No |
| Lithography | 45 nm |
| Max TDP | 80 W |
| VID Voltage Range | 0.8500V-1.3500V |
| TCASE | 66°C |
| Package Size | 37.5mm x 37.5mm |
| Processing Die Size | 107 mm2 |
| # of Processing Die Transistors | 410 million |
| Sockets Supported | LGA771 |
| Intel® Turbo Boost Technology | No |
| Intel® Hyper-Threading Technology | No |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® 64 | Yes |
| Idle States | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Intel® Demand Based Switching | Yes |
| Thermal Monitoring Technologies | Yes |
| Trusted Execution Technology | No |
| Execute Disable Bit | Yes |
