Specifications | ||
Status | Launched | |
Launch Date | Q1'09 | |
Processor Number | X5570 | |
# of Cores | 4 | |
# of Threads | 8 | |
Clock Speed | 2.93 GHz | |
Max Turbo Frequency | 3.333 GHz | |
Intel® Smart Cache | 8 MB | |
Intel® QPI Speed | 6.4 GT/s | |
# of QPI Links | 2 | |
Instruction Set | 64-bit | |
Embedded Options Available | No | |
Lithography | 45 nm | |
Max TDP | 95 W | |
VID Voltage Range | 0.750V -1.350V |
Memory Types | DDR3-800/1066/1333 |
# of Memory Channels | 3 |
Max Memory Bandwidth | 32 GB/s |
Physical Address Extensions | 40-bit |
ECC Memory Supported | Yes |
Max CPU Configuration | 2 |
TCASE | 75°C |
Package Size | 42.5mm x 45mm |
Processing Die Size | 263 mm2 |
# of Processing Die Transistors | 731 million |
Sockets Supported | FCLGA1366 |
Intel® Turbo Boost Technology | Yes |
Intel® Hyper-Threading Technology | Yes |
Intel® Virtualization Technology (VT-x) | Yes |
Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® VT-x with Extended Page Tables (EPT) | Yes |
Intel® 64 | Yes |
Idle States | Yes |
Enhanced Intel SpeedStep® Technology | Yes |
Intel® Demand Based Switching | Yes |
Trusted Execution Technology | No |
Execute Disable Bit | Yes |