| Specifications | ||
| Status | End of Life | |
| Launch Date | Q3'07 | |
| Expected Discontinuance | Q1'2010 | |
| Processor Number | X7350 | |
| # of Cores | 4 | |
| Clock Speed | 2.93 GHz | |
| L2 Cache | 8 MB | |
| FSB Speed | 1066 MHz | |
| FSB Parity | Yes | |
| Instruction Set | 64-bit | |
| Embedded Options Available | No | |
| Lithography | 65 nm | |
| Max TDP | 130 W | |
| VID Voltage Range | 1.0000V-1.5000V | |
| TCASE | 66°C |
| Package Size | 53.3mm x 53.3mm |
| Processing Die Size | 286 mm2 |
| # of Processing Die Transistors | 582 million |
| Sockets Supported | PGA604, PPGA604 |
| Intel® Turbo Boost Technology | No |
| Intel® Hyper-Threading Technology | No |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® 64 | Yes |
| Idle States | Yes |
| Enhanced Intel SpeedStep® Technology | Yes |
| Intel® Demand Based Switching | Yes |
| Thermal Monitoring Technologies | Yes |
| Trusted Execution Technology | No |
| Execute Disable Bit | Yes |
