| Status | End of Life |
| Expected Discontinuance | Q1'2008 |
| Processor Number | 5050 |
| # of Cores | 2 |
| Clock Speed | 3 GHz |
| L2 Cache | 4 MB |
| FSB Speed | 667 MHz |
| FSB Parity | Yes |
| Instruction Set | 64-bit |
| Embedded Options Available | No |
| Lithography | 65 nm |
| Max TDP | 95 W |
| Scenario Design Power (SDP) | 0 W |
| VID Voltage Range | 1.075V-1.350V |
| TCASE | 67°C |
| Package Size | 37.5mm x 37.5mm |
| Processing Die Size | 162 mm2 |
| # of Processing Die Transistors | 376 million |
| Sockets Supported | PLGA771 |
| Intel® Turbo Boost Technology | No |
| Intel® Hyper-Threading Technology | Yes |
| Intel® Virtualization Technology (VT-x) | Yes |
| Intel® VT-x with Extended Page Tables (EPT) | No |
| Intel® 64 | Yes |
| Idle States | No |
| Enhanced Intel SpeedStep® Technology | Yes |
| Intel® Demand Based Switching | No |
| Trusted Execution Technology | No |
| Execute Disable Bit | Yes |
